Prediction of microelectronics thermal behavior in electronic equipment : Status, challenges and future requirements

Document title
Prediction of microelectronics thermal behavior in electronic equipment : Status, challenges and future requirements

Author(s)
RODGERS Peter

Author(s) Affiliation(s)
(1) Electronics Thermal Management, Ltd. Upper Quay, Westport, Co. Mayo, IRLANDE

Abstract
Developing virtual performance- and reliability predictive techniques has become essential for the development of (micro)electronic systems. This paper provides an overview of current predictive methodologies, challenges and requirements for the modeling of microelectronics thennal behavior. Critical modeling issues are discussed, from optimizing Integrated Circuit (IC) packaging thermal perfonnance to predicting operational temperature in application environments. A systematic assessment of numerical predictive accuracy for board-mounted electronic component heat transfer is presented. From this evaluation, perspective is given on the current capabilities of Computational Fluids Dynamics (CFD) as a design tool to predict component operational temperature in electronic systems. Potential development areas are discussed for improved analysis.

Journal Title
Journal of microelectronics and electronic packaging ISSN 1551-4897

Source
2004, vol. 1, no1, pp. 16-29 [14 page(s) (article)] (98 ref.)

Publisher
International Microelectronics and Packaging Society, Washington, DC, ETATS-UNIS (2004)

Keywords
Circuit design ; Printed circuit ; Computer aided design ; Computational fluid dynamics ; Heat transfer ; Printed circuit board ; Programming environment ; Electronic packaging ; Integrated circuit ; Modeling ; Review ; Electronic component ; Micromachine ; Reliability ; Performance evaluation ; Electronic equipment ; Thermal behavior

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